Memory stacks having silicon oxynitride gate-to-gate dielectric layers and methods for forming the same

ABSTRACT

Embodiments of 3D memory devices and methods for forming the same are disclosed. In an example, a 3D memory device includes a substrate, a memory stack, and a NAND memory string. The memory stack includes a plurality of interleaved gate conductive layers and gate-to-gate dielectric layers above the substrate. Each of the gate-to-gate dielectric layers includes a silicon oxynitride layer. The NAND memory string extends vertically through the interleaved gate conductive layers and gate-to-gate dielectric layers of the memory stack.

CROSS REFERENCE TO RELATED APPLICATION

This application is continuation of International Application No.PCT/CN2019/080444, filed on Mar. 29, 2019, entitled “MEMORY STACKSHAVING SILICON OXYNITRIDE GATE-TO-GATE DIELECTRIC LAYERS AND METHODS FORFORMING THE SAME,” which is hereby incorporated by reference in itsentirety. This application is also related to co-pending U.S.application Ser. No. 16/455,638, filed on even date, entitled “MEMORYSTACKS HAVING SILICON NITRIDE GATE-TO-GATE DIELECTRIC LAYERS AND METHODSFOR FORMING THE SAME,” which is hereby incorporated by reference in itsentirety.

BACKGROUND

Embodiments of the present disclosure relate to three-dimensional (3D)memory devices and fabrication methods thereof.

Planar memory cells are scaled to smaller sizes by improving processtechnology, circuit design, programming algorithm, and fabricationprocess. However, as feature sizes of the memory cells approach a lowerlimit, planar process and fabrication techniques become challenging andcostly. As a result, memory density for planar memory cells approachesan upper limit.

A 3D memory architecture can address the density limitation in planarmemory cells.

The 3D memory architecture includes a memory array and peripheraldevices for controlling signals to and from the memory array.

SUMMARY

Embodiments of 3D memory devices and methods for forming the same aredisclosed herein.

In one example, a 3D memory device includes a substrate, a memory stack,and a NAND memory string. The memory stack includes a plurality ofinterleaved gate conductive layers and gate-to-gate dielectric layersabove the substrate. Each of the gate-to-gate dielectric layers includesa silicon oxynitride layer. The NAND memory string extends verticallythrough the interleaved gate conductive layers and gate-to-gatedielectric layers of the memory stack.

In another example, a method for forming a 3D memory device isdisclosed. A NAND memory string extending vertically through adielectric stack including a plurality of interleaved sacrificial layersand dielectric layers above a substrate is formed. A slit openingextending vertically through the interleaved sacrificial layers anddielectric layers of the dielectric stack is formed. A plurality oflateral recesses is formed by removing the sacrificial layers throughthe slit opening. A plurality of gate-to-gate dielectric layers areformed by oxidizing the dielectric layers through the slit opening andthe lateral recesses. A memory stack including a plurality ofinterleaved gate conductive layers and the gate-to-gate dielectriclayers by depositing the gate conductive layers into the lateralrecesses through the slit opening.

In still another example, a method for forming a 3D memory device isdisclosed. A plurality of polysilicon layers and a plurality of siliconnitride layers are alternatingly deposited above a substrate. A channelstructure extending vertically through the polysilicon layers andsilicon nitride layers is formed. The polysilicon layers are etchedselective to the silicon nitride layers to form a plurality of lateralrecesses. The silicon nitride layers are oxidized, such that each of thesilicon nitride layers becomes at least a silicon oxynitride layer. Aplurality of metal layers are deposited into the lateral recesses.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated herein and form a partof the specification, illustrate embodiments of the present disclosureand, together with the description, further serve to explain theprinciples of the present disclosure and to enable a person skilled inthe pertinent art to make and use the present disclosure.

FIG. 1A illustrates a cross-section of an exemplary 3D memory devicewith a memory stack having silicon oxynitride gate-to-gate dielectriclayers, according to some embodiments of the present disclosure.

FIG. 1B illustrates a cross-section of another exemplary 3D memorydevice with a memory stack having silicon oxynitride gate-to-gatedielectric layers, according to some embodiments of the presentdisclosure.

FIG. 2A illustrates a cross-section of an exemplary silicon oxynitridegate-to-gate dielectric layer, according to some embodiments of thepresent disclosure.

FIG. 2B illustrates a cross-section of another exemplary siliconoxynitride gate-to-gate dielectric layer, according to some embodimentsof the present disclosure.

FIG. 3A illustrates a cross-section of an exemplary 3D memory devicewith a memory stack having silicon nitride gate-to-gate dielectriclayers, according to some embodiments of the present disclosure.

FIG. 3B illustrates a cross-section of another exemplary 3D memorydevice with a memory stack having silicon nitride gate-to-gatedielectric layers, according to some embodiments of the presentdisclosure.

FIGS. 4A-4C illustrate an exemplary fabrication process for forming aNAND memory string, according to some embodiments of the presentdisclosure.

FIGS. 5A-5D illustrate an exemplary fabrication process for forming a 3Dmemory device with a memory stack having silicon oxynitride gate-to-gatedielectric layers, according to some embodiments of the presentdisclosure.

FIGS. 6A and 6B illustrate an exemplary fabrication process for forminga 3D memory device with a memory stack having silicon nitridegate-to-gate dielectric layers, according to some embodiments of thepresent disclosure.

FIGS. 7A-7C illustrate an exemplary fabrication process for forminganother NAND memory string, according to some embodiments of the presentdisclosure.

FIGS. 8A-8D illustrate an exemplary fabrication process for forminganother 3D memory device with a memory stack having silicon oxynitridegate-to-gate dielectric layers, according to some embodiments of thepresent disclosure.

FIGS. 9A and 9B illustrate an exemplary fabrication process for forminganother 3D memory device with a memory stack having silicon nitridegate-to-gate dielectric layers, according to some embodiments of thepresent disclosure.

FIG. 10 illustrates a flowchart of an exemplary method for forming a 3Dmemory device with a memory stack having silicon oxynitride gate-to-gatedielectric layers, according to some embodiments of the presentdisclosure.

FIG. 11 illustrates a flowchart of an exemplary method for forming a 3Dmemory device with a memory stack having silicon nitride gate-to-gatedielectric layers, according to some embodiments of the presentdisclosure.

Embodiments of the present disclosure will be described with referenceto the accompanying drawings.

DETAILED DESCRIPTION

Although specific configurations and arrangements are discussed, itshould be understood that this is done for illustrative purposes only. Aperson skilled in the pertinent art will recognize that otherconfigurations and arrangements can be used without departing from thespirit and scope of the present disclosure. It will be apparent to aperson skilled in the pertinent art that the present disclosure can alsobe employed in a variety of other applications.

It is noted that references in the specification to “one embodiment,”“an embodiment,” “an example embodiment,” “some embodiments,” etc.,indicate that the embodiment described may include a particular feature,structure, or characteristic, but every embodiment may not necessarilyinclude the particular feature, structure, or characteristic. Moreover,such phrases do not necessarily refer to the same embodiment. Further,when a particular feature, structure or characteristic is described inconnection with an embodiment, it would be within the knowledge of aperson skilled in the pertinent art to effect such feature, structure orcharacteristic in connection with other embodiments whether or notexplicitly described.

In general, terminology may be understood at least in part from usage incontext. For example, the term “one or more” as used herein, dependingat least in part upon context, may be used to describe any feature,structure, or characteristic in a singular sense or may be used todescribe combinations of features, structures or characteristics in aplural sense. Similarly, terms, such as “a,” “an,” or “the,” again, maybe understood to convey a singular usage or to convey a plural usage,depending at least in part upon context. In addition, the term “basedon” may be understood as not necessarily intended to convey an exclusiveset of factors and may, instead, allow for existence of additionalfactors not necessarily expressly described, again, depending at leastin part on context.

It should be readily understood that the meaning of “on,” “above,” and“over” in the present disclosure should be interpreted in the broadestmanner such that “on” not only means “directly on” something but alsoincludes the meaning of “on” something with an intermediate feature or alayer therebetween, and that “above” or “over” not only means themeaning of “above” or “over” something but can also include the meaningit is “above” or “over” something with no intermediate feature or layertherebetween (i.e., directly on something).

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper,” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

As used herein, the term “substrate” refers to a material onto whichsubsequent material layers are added. The substrate itself can bepatterned. Materials added on top of the substrate can be patterned orcan remain unpatterned. Furthermore, the substrate can include a widearray of semiconductor materials, such as silicon, germanium, galliumarsenide, indium phosphide, etc. Alternatively, the substrate can bemade from an electrically non-conductive material, such as a glass, aplastic, or a sapphire wafer.

As used herein, the term “layer” refers to a material portion includinga region with a thickness. A layer can extend over the entirety of anunderlying or overlying structure or may have an extent less than theextent of an underlying or overlying structure. Further, a layer can bea region of a homogeneous or inhomogeneous continuous structure that hasa thickness less than the thickness of the continuous structure. Forexample, a layer can be located between any pair of horizontal planesbetween, or at, a top surface and a bottom surface of the continuousstructure. A layer can extend horizontally, vertically, and/or along atapered surface. A substrate can be a layer, can include one or morelayers therein, and/or can have one or more layer thereupon, thereabove,and/or therebelow. A layer can include multiple layers. For example, aninterconnect layer can include one or more conductor and contact layers(in which interconnect lines and/or via contacts are formed) and one ormore dielectric layers.

As used herein, the term “nominal/nominally” refers to a desired, ortarget, value of a characteristic or parameter for a component or aprocess operation, set during the design phase of a product or aprocess, together with a range of values above and/or below the desiredvalue. The range of values can be due to slight variations inmanufacturing processes or tolerances. As used herein, the term “about”indicates the value of a given quantity that can vary based on aparticular technology node associated with the subject semiconductordevice. Based on the particular technology node, the term “about” canindicate a value of a given quantity that varies within, for example,10-30% of the value (e.g., ±10%, ±20%, or ±30% of the value).

As used herein, the term “3D memory device” refers to a semiconductordevice with vertically oriented strings of memory cell transistors(referred to herein as “memory strings,” such as NAND memory strings) ona laterally-oriented substrate so that the memory strings extend in thevertical direction with respect to the substrate. As used herein, theterm “vertical/vertically” means nominally perpendicular to the lateralsurface of a substrate.

3D memory devices, such as 3D NAND memory devices, can be verticallyscaled-up by forming more films (e.g., metal gate conductive layers andsilicon oxide gate-to-gate dielectric layers) in the memory stack havinga multi-deck architecture. A number of high-temperature thermalprocesses may be applied during the formation of memory stringsextending through the multi-deck memory stack, such as thermal annealingfor releasing stress after channel hole etching, hydrogen gas bakepre-treatment for silicon selective epitaxial growth (SEG), and thehigh-temperature SEG process itself (e.g., over 850° C.). The thermalbudget for the films in the upper deck of the memory stack is less thanthe thermal budget for the films in the lower deck because the upperdeck undergoes fewer high-temperature thermal processes during thefabrication processes. Due to the thermal budget difference, the qualityof the silicon oxide gate-to-gate dielectric layers in the upper deckbecomes worse than that in the lower deck, for example, with less oxidefilm shrinkage and looser film structure. Accordingly, during the latergate replacement process, which etches silicon nitride sacrificiallayers, the silicon oxide films in the upper deck may have significantloss both laterally on the sidewalls of channel structures andvertically in the thickness of each silicon oxide gate-to-gatedielectric layer. The nonuniform silicon oxide film loss may reduceproduction yield and/or electrical performance of the 3D memory devices(e.g., with more gate-to-gate coupling and leakage problems).

Various embodiments in accordance with the present disclosure providememory stacks having non-silicon oxide gate-to-gate dielectric layersand fabrication methods thereof. The non-silicon oxide gate-to-gatedielectric layers can include silicon oxynitride layers or siliconnitride layers. In some embodiments in which polysilicon layers are usedas the sacrificial layers, the high etch selectivity between polysiliconand silicon nitride can avoid the thermal budget difference-inducedupper-to-lower deck oxide loss during gate replacement. In someembodiments, since silicon nitride has a higher dielectric constant thanthat of silicon oxide, silicon nitride gate-to-gate dielectric layerscan reduce the chance of gate-to-gate coupling and leakage. In someembodiments, a silicon nitride film may be further oxidized to become asilicon oxynitride film or even a multi-layer film including siliconoxynitride, which have better electrical barrier performance thansilicon oxide films as gate-to-gate dielectric materials. As a result,production yield and electrical performance of 3D memory devices can beimproved by the memory stacks having non-silicon oxide gate-to-gatedielectric layers disclosed herein.

FIG. 1A illustrates a cross-section of an exemplary 3D memory device 100with a memory stack 104 having silicon oxynitride gate-to-gatedielectric layers, according to some embodiments of the presentdisclosure. 3D memory device 100 can include a substrate 102, which caninclude silicon (e.g., single crystalline silicon), silicon germanium(SiGe), gallium arsenide (GaAs), germanium (Ge), silicon on insulator(SOI), germanium on insulator (GOI), or any other suitable materials. Insome embodiments, substrate 102 is a thinned substrate (e.g., asemiconductor layer), which was thinned by grinding, etching, chemicalmechanical polishing (CMP), or any combination thereof. It is noted thatx and y axes are included in FIG. 1A to further illustrate the spatialrelationship of the components in 3D memory device 100. Substrate 102 of3D memory device 100 includes two lateral surfaces (e.g., a top surfaceand a bottom surface) extending laterally in the x-direction (i.e., thelateral direction). As used herein, whether one component (e.g., a layeror a device) is “on,” “above,” or “below” another component (e.g., alayer or a device) of a 3D memory device (e.g., 3D memory device 100) isdetermined relative to the substrate of the 3D memory device (e.g.,substrate 102) in the y-direction (i.e., the vertical direction) whenthe substrate is positioned in the lowest plane of the 3D memory devicein the y-direction. The same notion for describing spatial relationshipis applied throughout the present disclosure.

3D memory device 100 can be part of a monolithic 3D memory device. Theterm “monolithic” means that the components (e.g., the peripheral deviceand memory array device) of the 3D memory device are formed on a singlesubstrate. For monolithic 3D memory devices, the fabrication encountersadditional restrictions due to the convolution of the peripheral deviceprocessing and the memory array device processing. For example, thefabrication of the memory array device (e.g., NAND memory strings) isconstrained by the thermal budget associated with the peripheral devicesthat have been formed or to be formed on the same substrate.

Alternatively, 3D memory device 100 can be part of a non-monolithic 3Dmemory device, in which components (e.g., the peripheral device andmemory array device) can be formed separately on different substratesand then bonded, for example, in a face-to-face manner. In someembodiments, the memory array device substrate (e.g., substrate 102)remains as the substrate of the bonded non-monolithic 3D memory device,and the peripheral device (e.g., including any suitable digital, analog,and/or mixed-signal peripheral circuits used for facilitating theoperation of 3D memory device 100, such as page buffers, decoders, andlatches; not shown) is flipped and faces down toward the memory arraydevice (e.g., NAND memory strings) for hybrid bonding. It is understoodthat in some embodiments, the memory array device substrate (e.g.,substrate 102) is flipped and faces down toward the peripheral device(not shown) for hybrid bonding, so that in the bonded non-monolithic 3Dmemory device, the memory array device is above the peripheral device.The memory array device substrate (e.g., substrate 102) can be a thinnedsubstrate (which is not the substrate of the bonded non-monolithic 3Dmemory device), and the back-end-of-line (BEOL) interconnects of thenon-monolithic 3D memory device can be formed on the backside of thethinned memory array device substrate.

In some embodiments, 3D memory device 100 is a NAND Flash memory devicein which memory cells are provided in the form of an array of NANDmemory strings 110 each extending vertically above substrate 102. Thememory array device can include NAND memory strings 110 that extendthrough a plurality of pairs each including a gate conductive layer 106and a gate-to-gate dielectric layer 108. The interleaved gate conductivelayers 106 and gate-to-gate dielectric layers 108 are part of memorystack 104. The number of the pairs of gate conductive layers 106 andgate-to-gate dielectric layers 108 in memory stack 104 (e.g., 32, 64,96, or 128) determines the number of memory cells in 3D memory device100. Memory stack 104 can include a plurality of interleaved gateconductive layers 106 and gate-to-gate dielectric layers 108. Gateconductive layers 106 and gate-to-gate dielectric layers 108 in memorystack 104 can alternate in the vertical direction. In other words,except the ones at the top or bottom of memory stack 104, each gateconductive layer 106 can be adjoined by two gate-to-gate dielectriclayers 108 on both sides, and each gate-to-gate dielectric layer 108 canbe adjoined by two gate conductive layers 106 on both sides. Gateconductive layers 106 can each have the same thickness or differentthicknesses. Similarly, gate-to-gate dielectric layers 108 can each havethe same thickness or different thicknesses.

Each gate conductive layer 106 can include conductive materialsincluding, but not limited to, tungsten (W), cobalt (Co), copper (Cu),aluminum (Al), polysilicon, doped silicon, silicides, or any combinationthereof. In some embodiments, each gate conductive layers 106 includes ametal layer, such as a tungsten layer. In some embodiments, each gateconductive layer 106 includes a doped polysilicon layer. Polysilicon canbe doped to a desired doping concentration with any suitable dopant tobecome a conductive material that can be used as the material of gatelines. The thickness of each gate conductive layer 106 can be betweenabout 10 nm and about 50 nm, such as between 10 nm and 50 nm (e.g., 10nm, 15 nm, 20 nm, 25 nm, 30 nm, 35 nm, 40 nm, 45 nm, 50 nm, any rangebounded by the lower end by any of these values, or in any range definedby any two of these values). Each gate conductive layer 106 can be agate electrode (gate line) surrounding NAND memory string 110 and canextend laterally as a word line.

Different from some known 3D memory devices having silicon oxidegate-to-gate-dielectric layers (e.g., each gate-to-gate dielectric layerincludes a single silicon oxide layer), 3D memory device 100 can usenon-silicon oxide gate-to-gate dielectric layers in memory stack 104 toavoid thermal budget difference-induced upper-to-lower deck oxide lossas well as improve barrier performance with reduced gate-to-gatecoupling and leakage. In some embodiments, each gate-to-gate dielectriclayer 108 includes a silicon oxynitride layer (referred to herein as a“silicon oxynitride gate-to-gate dielectric layer”). Silicon oxynitride(SiN_(x)O_(y)) has a dielectric constant higher than that of siliconoxide, for example, between about 4 and about 7, such as between 4 and7, at about 20° C. and thus, having better barrier performance than thatof silicon oxide as the material of gate-to-gate dielectric layers. Thethickness of gate-to-gate dielectric layer 108 can be between about 10nm and about 50 nm, such as between 10 nm and 50 nm (e.g., 10 nm, 15 nm,20 nm, 25 nm, 30 nm, 35 nm, 40 nm, 45 nm, 50 nm, any range bounded bythe lower end by any of these values, or in any range defined by any twoof these values).

The structure of a silicon oxynitride gate-to-gate dielectric layer(e.g., gate-to-gate dielectric layer 108) can vary in differentexamples. FIG. 2A illustrates a cross-section of an exemplary siliconoxynitride gate-to-gate dielectric layer 204, according to someembodiments of the present disclosure. As shown in FIG. 2A, each siliconoxynitride gate-to-gate dielectric layer 204 stacked between two gateconductive layers 202 consists of a silicon oxynitride layer, i.e., is asingle layer made of silicon oxynitride, according to some embodiments.FIG. 2B illustrates a cross-section of another exemplary siliconoxynitride gate-to-gate dielectric layer 206, according to someembodiments of the present disclosure. As shown in FIG. 2B, each siliconoxynitride gate-to-gate dielectric layer 206 stacked between two gateconductive layers 202 is a composite layer having multiple sub-layers atleast one of which is a silicon oxynitride layer 208, according to someembodiments. That is, each gate-to-gate dielectric layer 206 can includesilicon oxynitride layer 208 and at least one silicon oxide layer 210.As shown in FIG. 2B, each gate-to-gate dielectric layer 206 includessilicon oxynitride layer 208 stacked between two silicon oxide layers210, according to some embodiments. In other words, gate-to-gatedielectric layer 206 can be a composite layer in the form ofSiO₂/SiO_(x)N_(y)/SiO₂. It is understood that the number of siliconoxide layers in the composite layer is not limited as long as thecomposite layer includes at least one silicon oxynitride layer. Asdescribed below in detail, the composite layer structure of a siliconoxynitride gate-to-gate dielectric layer can be achieved by controllingthe oxygen diffusion concentration in oxidizing silicon nitride layers.

Referring back to FIG. 1A, in some embodiments, memory stack 104 has amulti-deck architecture (e.g., a dual-deck architecture as shown in FIG.1A), which includes a lower memory deck 134 above substrate 102 and anupper memory deck 136 above lower memory deck 134. The numbers of thepairs of gate conductive layers 106 and gate-to-gate dielectric layers108 in each of lower and upper memory decks 134 and 136 can be the sameor different. Each of lower and upper memory decks 134 and 136 caninclude interleaved gate conductive layers 106 and gate-to-gatedielectric layers 108 (each including a silicon oxynitride layer) asdescribed above. Memory stack 104 can further include an inter-deckdielectric layer 138 between lower and upper memory decks 134 and 136.In some embodiments, inter-deck dielectric layer 138 includes the samematerials as gate-to-gate dielectric layers 108, e.g., siliconoxynitride, and thus, is considered as part of lower memory deck 134 orupper memory deck 136.

As shown in FIG. 1A, NAND memory string 110 can include a lower channelstructure 112 extending vertically through lower memory deck 134, anupper channel structure 114 extending vertically through upper memorydeck 136, and an inter-deck plug 116 vertically between and in contactwith lower channel structure 112 and upper channel structure 114,respectively. Lower channel structure 112 can include a channel holefilled with a semiconductor layer (e.g., as a semiconductor channel 122)and multiple dielectric layers (e.g., as a memory film 120). In someembodiments, semiconductor channel 122 includes silicon, such asamorphous silicon, polysilicon, or single-crystal silicon. In someembodiments, memory film 120 is a composite layer including a tunnelinglayer, a storage layer (also known as a “charge trap layer”), and ablocking layer. The remaining space of lower channel structure 112 canbe partially or fully filled with a capping layer 124 includingdielectric materials, such as silicon oxide. Lower channel structure 112can have a cylinder shape (e.g., a pillar shape). Capping layer 124,semiconductor channel 122, the tunneling layer, storage layer, andblocking layer of memory film 120 are arranged radially from the centertoward the outer surface of the pillar in this order, according to someembodiments. The tunneling layer can include silicon oxide, siliconoxynitride, or any combination thereof. The storage layer can includesilicon nitride, silicon oxynitride, silicon, or any combinationthereof. The blocking layer can include silicon oxide, siliconoxynitride, high dielectric constant (high-k) dielectrics, or anycombination thereof. In one example, memory film 120 can include acomposite layer of silicon oxide/silicon oxynitride/silicon oxide (ONO).Similarly, upper channel structure 114 can include a memory film 128, asemiconductor channel 130, and a capping layer 148 arranged radiallyfrom the center toward the outer surface of the pillar in this order.

In some embodiments, lower channel structure 112 further includes asemiconductor plug 118 in the lower portion (e.g., at the lower end) oflower channel structure 112. As used herein, the “upper end” of acomponent (e.g., lower channel structure 112) is the end farther awayfrom substrate 102 in the y-direction, and the “lower end” of thecomponent (e.g., lower channel structure 112) is the end closer tosubstrate 102 in the y-direction when substrate 102 is positioned in thelowest plane of 3D memory device 100. Semiconductor plug 118 can includea semiconductor material, such as silicon, which is epitaxially grownfrom substrate 102 in any suitable directions. It is understood that insome embodiments, semiconductor plug 118 includes single-crystalsilicon, the same material of substrate 102. In other words,semiconductor plug 118 can include an epitaxially-grown semiconductorlayer that is the same as the material of substrate 102. Semiconductorplug 118 can function as a channel controlled by a source select gate ofNAND memory string 110.

In some embodiments, lower channel structure 112 further includes achannel plug 126 in the upper portion (e.g., at the upper end) of lowerchannel structure 112. Channel plug 126 can be in contact with the upperend of semiconductor channel 122. Channel plug 126 can includesemiconductor materials (e.g., polysilicon). In some embodiments,channel plug 126 includes an opening filled with Ti/TiN or Ta/TaN as anadhesion layer and tungsten as a conductor. By covering the upper end oflower channel structure 112 during the fabrication of 3D memory device100, channel plug 126 can function as an etch stop layer to preventetching of dielectrics filled in lower channel structure 112, such assilicon oxide and silicon nitride. Similarly, upper channel structure114 can include a channel plug 132 as well at the upper end of NANDmemory string 110. In some embodiments, channel plug 132 can function asthe drain of NAND memory string 110.

As shown in FIG. 1A, lower channel structure 112 and upper channelstructure 114 can be electrically connected to inter-deck plug 116disposed therebetween. Inter-deck plug 116 can include silicon, such asamorphous silicon, polysilicon, or single-crystal silicon. In someembodiments, inter-deck plug 116 is disposed above and in contact withchannel plug 126 of lower channel structure 112 to be electricallyconnected to lower channel structure 112. In some embodiments,inter-deck plug 116 is disposed below and in contact with semiconductorchannel 130 of upper channel structure 114 to be electrically connectedto upper channel structure 114. Multiple inter-deck plugs 116 of anarray of NAND memory strings 110 can be surrounded and electricallyisolated by inter-deck dielectric layer 138.

As shown in FIG. 1A, 3D memory device 100 further includes a slitstructure 142 extending vertically through interleaved gate conductivelayers 106 and gate-to-gate dielectric layers 108 of memory stack 104.Slit structure 142 can also extend laterally to separate memory stack104 into multiple blocks. Slit structure 142 can include a slit openingthat provides access for the chemical precursor to form gate conductivelayers 106. In some embodiments, slit structure 142 includes a slitcontact 146 having conductive materials including, but not limited to,W, Co, Cu, Al, polysilicon, silicides, or any combination thereof. Toelectrically isolate slit contact 146 from gate conductive layers 106,slit structure 142 can further include a spacer 144 disposed along thesidewall of the slit opening and in etch-back recesses 140 abutting thesidewall of the slit opening. Spacer 144 can include one or more layersof dielectric materials, such as silicon oxide, silicon nitride, siliconoxynitride, or any combination thereof. In some embodiments, slitcontact 146 of slit structure 142 works as the source contact of 3Dmemory device 100 and electrically connects to the source of NAND memorystring 110, e.g., an array common source (ACS) of the array of NANDmemory strings 110.

In FIG. 1A, NAND memory string 110 includes two channel structures 112and 114 electrically connected by inter-deck plug 116, which is alsoknown as a dual-cell formation (DCF) structure. FIG. 1B illustrates across-section of another exemplary 3D memory device 101 with a memorystack 103 having silicon oxynitride gate-to-gate dielectric layers,according to some embodiments of the present disclosure. Different fromFIG. 1A in which NAND memory string 110 has a DCF structure, 3D memorydevice 101 in FIG. 1B includes a NAND memory string 109 including asingle channel structure 111, which is also known as a single-cellformation (SCF) structure. The remaining components of 3D memory device101 are substantially similar to their counterparts in 3D memory device100 in FIG. 1A and thus, may not be repeated in detail herein.

In some embodiments, 3D memory device 101 is a NAND Flash memory devicein which memory cells are provided in the form of an array of NANDmemory strings 109 each extending vertically above substrate 102. Memorystack 103 can include a plurality of interleaved gate conductive layers105 and gate-to-gate dielectric layers 107. In some embodiments, eachgate conductive layer 105 includes a metal layer, such as a tungstenlayer. In some embodiments, each gate conductive layer 105 includes adoped polysilicon layer. Different from some known 3D memory deviceshaving silicon oxide gate-to-gate-dielectric layers (e.g., eachgate-to-gate dielectric layer includes a single silicon oxide layer), 3Dmemory device 101 can use non-silicon oxide gate-to-gate dielectriclayers in memory stack 103 to avoid thermal budget difference-inducedupper-to-lower deck oxide loss as well as improve barrier performancewith reduced gate-to-gate coupling and leakage. In some embodiments,each gate-to-gate dielectric layer 107 includes a silicon oxynitridelayer (referred to herein as a “silicon oxynitride gate-to-gatedielectric layer”). Each gate-to-gate dielectric layer 107 consists of asilicon oxynitride layer, i.e., is a single layer made of siliconoxynitride, according to some embodiments. In some embodiments, eachgate-to-gate dielectric layer 107 includes a silicon oxynitride layerand at least one silicon oxide layer, such as a silicon oxynitride layerstacked between two silicon oxide layers.

In some embodiments, memory stack 103 has a multi-deck architecture(e.g., a dual-deck architecture as shown in FIG. 1B), which includes alower memory deck 133 above substrate 102 and an upper memory deck 135above lower memory deck 133. Each of lower and upper memory decks 133and 135 can include interleaved gate conductive layers 105 andgate-to-gate dielectric layers 107 (each including a silicon oxynitridelayer) as described above. Memory stack 103 can further include aninter-deck dielectric layer 137 between lower and upper memory decks 133and 135. In some embodiments, inter-deck dielectric layer 137 includesthe same materials as gate-to-gate dielectric layers 107, e.g., siliconoxynitride, and thus, is considered as part of lower memory deck 133 orupper memory deck 135.

As shown in FIG. 1B, NAND memory string 109 can include single channelstructure 111 extending vertically through both lower memory deck 133and upper memory deck 135. Channel structure 111 can include two channelholes (e.g., a lower channel hole and an upper channel hole) connectedvertically and filled with a semiconductor layer (e.g., as asemiconductor channel 129) and multiple dielectric layers (e.g., as amemory film 127). In some embodiments, semiconductor channel 129includes silicon, such as amorphous silicon, polysilicon, orsingle-crystal silicon. In some embodiments, memory film 127 is acomposite layer including a tunneling layer, a storage layer (also knownas a “charge trap layer”), and a blocking layer. The remaining space ofchannel structure 111 can be partially or fully filled with a cappinglayer 123 including dielectric materials, such as silicon oxide. Channelstructure 111 can have a cylinder shape (e.g., a pillar shape). Cappinglayer 123, semiconductor channel 129, the tunneling layer, storagelayer, and blocking layer of memory film 127 are arranged radially fromthe center toward the outer surface of the pillar in this order,according to some embodiments. The tunneling layer can include siliconoxide, silicon oxynitride, or any combination thereof. The storage layercan include silicon nitride, silicon oxynitride, silicon, or anycombination thereof. The blocking layer can include silicon oxide,silicon oxynitride, high-k dielectrics, or any combination thereof.

In some embodiments, NAND memory string 109 further includes asemiconductor plug 117 in the lower portion (e.g., at the lower end) ofchannel structure 111. Semiconductor plug 117 can include asemiconductor material, such as single-crystal silicon, which isepitaxially grown from substrate 102 in any suitable directions.Semiconductor plug 117 can function as a channel controlled by a sourceselect gate of NAND memory string 109. In some embodiments, NAND memorystring 109 further includes a channel plug 131 in the upper portion(e.g., at the upper end) of channel structure 111. In some embodiments,channel plug 131 can function as the drain of NAND memory string 109.

As shown in FIG. 1B, 3D memory device 101 further includes slitstructure 142 extending vertically through interleaved gate conductivelayers 105 and gate-to-gate dielectric layers 107 of memory stack 103.In some embodiments, slit structure 142 includes slit contact 146working as the source contact of 3D memory device 101 and electricallyconnects to the source of NAND memory string 109, e.g., an ACS of thearray of NAND memory strings 109. To electrically isolate slit contact146 from gate conductive layers 105, slit structure 142 can furtherinclude spacer 144 disposed along the sidewall of the slit opening andin etch-back recesses 140 abutting the sidewall of the slit opening.

It is understood that beside silicon oxynitride, other non-silicon oxidedielectric materials may be used for forming the gate-to-gate dielectriclayers without oxide loss in the gate replacement process and havingsuperior gate-to-gate barrier performance. For example, FIG. 3Aillustrates a cross-section of an exemplary 3D memory device 300 with amemory stack 304 having silicon nitride gate-to-gate dielectric layers,according to some embodiments of the present disclosure. Different from3D memory device 100 described above with respect to FIG. 1A in whichsilicon oxynitride gate-to-gate dielectric layers are used, 3D memorydevice 300 includes silicon nitride gate-to-gate dielectric layers inmemory stack 304. The remaining components of 3D memory device 300 aresubstantially similar to their counterparts in 3D memory device 100 inFIG. 1A and thus, may not be repeated in detail herein.

In some embodiments, 3D memory device 300 is a NAND Flash memory devicein which memory cells are provided in the form of an array of NANDmemory strings 310 extending vertically above substrate 302. Memorystack 304 can include a plurality of interleaved gate conductive layers306 and gate-to-gate dielectric layers 308. Each gate conductive layer306 can include conductive materials including, but not limited to, W,Co, Cu, Al, polysilicon, doped silicon, silicides, or any combinationthereof. In some embodiments, each gate conductive layer 306 includes ametal layer, such as a tungsten layer. In some embodiments, each gateconductive layer 306 includes a doped polysilicon layer. Polysilicon canbe doped to a desired doping concentration with any suitable dopant tobecome a conductive material that can be used as the material of gatelines. The thickness of each gate conductive layer 306 can be betweenabout 10 nm and about 50 nm, such as between 10 nm and 50 nm (e.g., 10nm, 15 nm, 20 nm, 25 nm, 30 nm, 35 nm, 40 nm, 45 nm, 50 nm, any rangebounded by the lower end by any of these values, or in any range definedby any two of these values). Each gate conductive layer 306 can be agate electrode (gate line) surrounding NAND memory string 310 and canextend laterally as a word line.

Different from some known 3D memory devices having silicon oxidegate-to-gate-dielectric layers (e.g., each gate-to-gate dielectric layerincludes a single silicon oxide layer), 3D memory device 300 can usenon-silicon oxide gate-to-gate dielectric layers in memory stack 304 toavoid thermal budget difference-induced upper-to-lower deck oxide lossas well as improve barrier performance with reduced gate-to-gatecoupling and leakage. In some embodiments, each gate-to-gate dielectriclayer 308 includes a silicon nitride layer (referred to herein as a“silicon nitride gate-to-gate dielectric layer”). Silicon nitride(Si₃N₄) has a dielectric constant higher than that of silicon oxide, forexample, between about 7 and about 11, such as between 7 and 11, atabout 20° C. and thus, having better barrier performance than that ofsilicon oxide as the material of gate-to-gate dielectric layers 308. Thethickness of gate-to-gate dielectric layer 308 can be between about 10nm and about 50 nm, such as between 10 nm and 50 nm (e.g., 10 nm, 15 nm,20 nm, 25 nm, 30 nm, 35 nm, 40 nm, 45 nm, 50 nm, any range bounded bythe lower end by any of these values, or in any range defined by any twoof these values). In some embodiments, each gate-to-gate dielectriclayer 308 consists of a silicon nitride layer, i.e., is a single layermade of silicon nitride. Each gate-to-gate dielectric layer 308 does notinclude a silicon oxide layer, according to some embodiments. Eachgate-to-gate dielectric layer 308 does not include a silicon oxynitridelayer, according to some embodiments.

In some embodiments, memory stack 304 has a multi-deck architecture(e.g., a dual-deck architecture as shown in FIG. 3A), which includes alower memory deck 334 above substrate 302 and an upper memory deck 336above lower memory deck 334. Each of lower and upper memory decks 334and 336 can include interleaved gate conductive layers 306 andgate-to-gate dielectric layers 308 (each including a silicon nitridelayer) as described above. Memory stack 304 can further include aninter-deck dielectric layer 338 between lower and upper memory decks 334and 336. In some embodiments, inter-deck dielectric layer 338 includesthe same materials as gate-to-gate dielectric layers 308, e.g., siliconnitride, and thus, is considered as part of lower memory deck 334 orupper memory deck 336.

As shown in FIG. 3A, NAND memory string 310 has a DCF structure thatincludes a lower channel structure 312 extending vertically throughlower memory deck 334, an upper channel structure 314 extendingvertically through upper memory deck 336, and an inter-deck plug 316vertically between and in contact with lower channel structure 312 andupper channel structure 314, respectively. Lower channel structure 312can include a channel hole filled with a semiconductor layer (e.g., as asemiconductor channel 322) and multiple dielectric layers (e.g., as amemory film 320). In some embodiments, semiconductor channel 322includes silicon, such as amorphous silicon, polysilicon, orsingle-crystal silicon. In some embodiments, memory film 320 is acomposite layer including a tunneling layer, a storage layer (also knownas a “charge trap layer”), and a blocking layer. The remaining space oflower channel structure 312 can be partially or fully filled with acapping layer 324 including dielectric materials, such as silicon oxide.Similarly, upper channel structure 314 can include a memory film 328, asemiconductor channel 330, and a capping layer 348 arranged radiallyfrom the center toward the outer surface of the pillar in this order.

In some embodiments, lower channel structure 312 further includes asemiconductor plug 318 in the lower portion (e.g., at the lower end) oflower channel structure 312. Semiconductor plug 318 can include asemiconductor material, such as single-crystal silicon, which isepitaxially grown from substrate 302 in any suitable directions.Semiconductor plug 318 can function as a channel controlled by a sourceselect gate of NAND memory string 310. In some embodiments, lowerchannel structure 312 further includes a channel plug 326 in an upperportion (e.g., at the upper end) of lower channel structure 312.Similarly, upper channel structure 314 can include a channel plug 332 aswell at the upper end of NAND memory string 310. In some embodiments,channel plug 332 can function as the drain of NAND memory string 310. Asshown in FIG. 3A, lower channel structure 312 and upper channelstructure 314 can be electrically connected to an inter-deck plug 316disposed therebetween. Inter-deck plug 316 can include silicon, such asamorphous silicon, polysilicon, or single crystalline silicon. Multipleinter-deck plugs 316 of array of NAND memory strings 310 can besurrounded and electrically isolated by inter-deck dielectric layer 338.

As shown in FIG. 3A, 3D memory device 300 further includes a slitstructure 342 extending vertically through interleaved gate conductivelayers 306 and gate-to-gate dielectric layers 308 of memory stack 304.In some embodiments, slit structure 342 includes a slit contact 346working as the source contact of 3D memory device 300 and electricallyconnects to the source of NAND memory string 310, e.g., an ACS of thearray of NAND memory strings 310. To electrically isolate slit contact346 from gate conductive layers 306, slit structure 342 can furtherinclude a spacer 344 disposed along the sidewall of the slit opening andin etch-back recesses 340 abutting the sidewall of the slit opening.

FIG. 3B illustrates a cross-section of another exemplary 3D memorydevice 301 with a memory stack 303 having silicon nitride gate-to-gatedielectric layers, according to some embodiments of the presentdisclosure. Different from FIG. 3A in which NAND memory string 310 has aDCF structure, 3D memory device 301 in FIG. 3B includes a NAND memorystring 309 including a single channel structure 311, which is also knownas a SCF structure. The remaining components of 3D memory device 301 aresubstantially similar to their counterparts in 3D memory device 300 inFIG. 3A and thus, may not be repeated in detail herein.

In some embodiments, 3D memory device 301 is a NAND Flash memory devicein which memory cells are provided in the form of an array of NANDmemory strings 309 each extending vertically above substrate 302. Memorystack 303 can include a plurality of interleaved gate conductive layers305 and gate-to-gate dielectric layers 307. In some embodiments, eachgate conductive layer 305 includes a metal layer, such as a tungstenlayer. In some embodiments, each gate conductive layer 305 includes adoped polysilicon layer. Different from some known 3D memory deviceshaving silicon oxide gate-to-gate-dielectric layers (e.g., eachgate-to-gate dielectric layer includes a single silicon oxide layer), 3Dmemory device 301 can use non-silicon oxide gate-to-gate dielectriclayers in memory stack 303 to avoid thermal budget difference-inducedupper-to-lower deck oxide loss as well as improve barrier performancewith reduced gate-to-gate coupling and leakage. In some embodiments,each gate-to-gate dielectric layer 307 includes a silicon nitride layer(referred to herein as a “silicon nitride gate-to-gate dielectriclayer”). Each gate-to-gate dielectric layer 307 consists of a siliconoxynitride layer, i.e., is a single layer made of silicon nitride,according to some embodiments. In some embodiments, each gate-to-gatedielectric layer 307 does not include a silicon oxide layer. In someembodiments, each gate-to-gate dielectric layer 307 does not include asilicon oxynitride layer.

In some embodiments, memory stack 303 has a multi-deck architecture(e.g., a dual-deck architecture as shown in FIG. 3B), which includes alower memory deck 333 above substrate 302 and an upper memory deck 335above lower memory deck 333. Each of lower and upper memory decks 333and 335 can include interleaved gate conductive layers 305 andgate-to-gate dielectric layers 307 (each including a silicon nitridelayer) as described above. Memory stack 303 can further include aninter-deck dielectric layer 337 between lower and upper memory decks 333and 335. In some embodiments, inter-deck dielectric layer 337 includesthe same materials as gate-to-gate dielectric layers 307, e.g., siliconnitride, and thus, is considered as part of lower memory deck 333 orupper memory deck 335.

As shown in FIG. 3B, NAND memory string 309 can include single channelstructure 311 extending vertically through both lower memory deck 333and upper memory deck 335. Channel structure 311 can include two channelholes (e.g., a lower channel hole and an upper channel hole) connectedvertically and filled with a semiconductor layer (e.g., as asemiconductor channel 329) and multiple dielectric layers (e.g., as amemory film 327). In some embodiments, semiconductor channel 329includes silicon, such as amorphous silicon, polysilicon, orsingle-crystal silicon. In some embodiments, memory film 327 is acomposite layer including a tunneling layer, a storage layer (also knownas a “charge trap layer”), and a blocking layer. The remaining space ofchannel structure 311 can be partially or fully filled with a cappinglayer 323 including dielectric materials, such as silicon oxide.

In some embodiments, NAND memory string 309 further includes asemiconductor plug 317 in the lower portion (e.g., at the lower end) ofchannel structure 311. Semiconductor plug 317 can include asemiconductor material, such as single-crystal silicon, which isepitaxially grown from substrate 302 in any suitable directions.Semiconductor plug 317 can function as a channel controlled by a sourceselect gate of NAND memory string 309. In some embodiments, NAND memorystring 309 further includes a channel plug 331 in the upper portion(e.g., at the upper end) of channel structure 311. In some embodiments,channel plug 331 can function as the drain of NAND memory string 309.

As shown in FIG. 3B, 3D memory device 301 further includes slitstructure 342 extending vertically through interleaved gate conductivelayers 305 and gate-to-gate dielectric layers 307 of memory stack 303.In some embodiments, slit structure 342 includes slit contact 346working as the source contact of 3D memory device 301 and electricallyconnects to the source of NAND memory string 309, e.g., an ACS of thearray of NAND memory strings 309. To electrically isolate slit contact346 from gate conductive layers 305, slit structure 342 can furtherinclude spacer 344 disposed along the sidewall of the slit opening andin etch-back recesses 340 abutting the sidewall of the slit opening.

FIGS. 4A-4C illustrate an exemplary fabrication process for forming aNAND memory string, according to some embodiments of the presentdisclosure. FIGS. 5A-5D illustrate an exemplary fabrication process forforming a 3D memory device with a memory stack having silicon oxynitridegate-to-gate dielectric layers, according to some embodiments of thepresent disclosure. FIGS. 7A-7C illustrate an exemplary fabricationprocess for forming another NAND memory string, according to someembodiments of the present disclosure. FIGS. 8A-8D illustrate anexemplary fabrication process for forming another 3D memory device witha memory stack having silicon oxynitride gate-to-gate dielectric layers,according to some embodiments of the present disclosure. FIG. 10illustrates a flowchart of an exemplary method 1000 for forming a 3Dmemory device with a memory stack having silicon oxynitride gate-to-gatedielectric layers, according to some embodiments of the presentdisclosure. Examples of the 3D memory device depicted in FIGS. 4A-4C,5A-5D, 7A-7C, and 8A-8D include 3D memory devices 100 and 101 depictedin FIGS. 1A and 1B. FIGS. 4A-4C, 5A-5D, 7A-7C, 8A-8D, and 10 will bedescribed together. It is understood that the operations shown in method1000 are not exhaustive and that other operations can be performed aswell before, after, or between any of the illustrated operations.Further, some of the operations may be performed simultaneously, or in adifferent order than shown in FIG. 10.

Referring to FIG. 10, method 1000 starts at operation 1002, in which aNAND memory string extending vertically through a dielectric stackincluding a plurality of interleaved sacrificial layers and dielectriclayers above a substrate is formed. The substrate can be a siliconsubstrate. In some embodiments, each of the sacrificial layers includesa polysilicon layer, and each of the dielectric layers includes asilicon nitride layer. In some embodiments, to form the NAND memorystring, a first dielectric deck is formed, and a first channel structureextending vertically through the first dielectric deck is formed. Insome embodiments, to form the NAND memory string, an inter-deck plug isformed above and in contact with the first channel structure. In someembodiments, to form the NAND memory string, a second dielectric deck isformed above the first dielectric deck, and a second channel structureextending vertically through the second dielectric deck is formed aboveand in contact with the inter-deck plug.

Referring to FIG. 4A, a lower dielectric deck 404 including a pluralitypairs of a sacrificial layer 406 and a dielectric layer 408 is formedabove a silicon substrate 402. Lower dielectric deck 404 includesinterleaved sacrificial layers 406 and dielectric layers 408, accordingto some embodiments. Dielectric layers 408 and sacrificial layers 406can be alternatingly deposited on silicon substrate 402 to form lowerdielectric deck 404. In some embodiments, each dielectric layer 408includes a layer of silicon nitride, and each sacrificial layer 406includes a layer of polysilicon. That is, a plurality of polysiliconlayers and a plurality of silicon nitride layers can be alternatinglydeposited above silicon substrate 402 to form lower dielectric deck 404.Polysilicon and silicon nitride are a pair of materials having highetching selectivity, for example, greater than 30, according to someembodiments. It is understood that other pairs of materials having highetching selectivity may be used the materials of dielectric layers 408and sacrificial layers 406 in other embodiments. Lower dielectric deck404 can be formed by one or more thin film deposition processesincluding, but not limited to, chemical vapor deposition (CVD), physicalvapor deposition (PVD), atomic layer deposition (ALD), or anycombination thereof.

As illustrated in FIG. 4A, a lower channel hole 410 is an opening formedextending vertically through lower dielectric deck 404. In someembodiments, a plurality of openings are formed through lower dielectricdeck 404 such that each opening becomes the location for growing anindividual NAND memory string in the later process. In some embodiments,fabrication processes for forming lower channel hole 410 include wetetching and/or dry etching, such as deep-ion reactive etching (DRIE). Insome embodiments, lower channel hole 410 extends further through the topportion of silicon substrate 402. The etching process through lowerdielectric deck 404 may not stop at the top surface of silicon substrate402 and may continue to etch part of silicon substrate 402.

As illustrated in FIG. 4B, a semiconductor plug 412 can be formed byfilling the lower portion of lower channel hole 410 (as shown in FIG.4A) with single-crystal silicon epitaxially grown from silicon substrate402 in any suitable directions (e.g., from bottom surface and/or sidesurface). The fabrication processes for epitaxially growingsemiconductor plug 412 can include, but not limited to, vapor-phaseepitaxy (VPE), liquid-phase epitaxy (LPE), molecular-beam epitaxy (MPE),or any combinations thereof.

As illustrated in FIG. 4B, a memory film 414 (including a blockinglayer, a storage layer, and a tunneling layer) and a semiconductorchannel 416 are formed along the sidewall of lower channel hole 410 andabove semiconductor plug 412. In some embodiments, memory film 414 isfirst deposited along the sidewall of lower channel hole 410 and abovesemiconductor plug 412, and semiconductor channel 416 is then depositedover memory film 414. The blocking layer, storage layer, and tunnelinglayer can be subsequently deposited in this order using one or more thinfilm deposition processes, such as ALD, CVD, PVD, any other suitableprocesses, or any combination thereof, to form memory film 414.Semiconductor channel 416 can then be formed by depositing polysiliconon the tunneling layer using one or more thin film deposition processes,such as ALD, CVD, PVD, any other suitable processes, or any combinationthereof. Semiconductor channel 416 can be in contact with semiconductorplug 412 using, for example, a SONO punch process. In some embodiments,semiconductor channel 416 is deposited in lower channel hole 410 withoutcompletely filling lower channel hole 410. As illustrated in FIG. 4B, acapping layer 418, such as a silicon oxide layer, is formed in lowerchannel hole 410 to fully or partially fill the remaining space of lowerchannel hole 410 using one or more thin film deposition processes, suchas CVD, PVD, ALD, electroplating, electroless plating, or anycombination thereof.

As illustrated in FIG. 4B, a channel plug 420 is formed in the upperportion of lower channel hole 410 (shown in FIG. 4A). In someembodiments, parts of memory film 414, semiconductor channel 416, andcapping layer 418 that are on the top surface of lower dielectric deck404 are removed and planarized by CMP, wet etching and/or dry etching. Arecess then can be formed in the upper portion of lower channel hole 410by wet etching and/or drying etching parts of memory film 414,semiconductor channel 416, and capping layer 418 in the upper portion oflower channel hole 410. Channel plug 420 then can be formed bydepositing semiconductor materials, such as polysilicon, into the recessby one or more thin film deposition processes, such as CVD, PVD, ALD,electroplating, electroless plating, or any combination thereof. A lowerchannel structure 422 is thereby formed through lower dielectric deck404.

As illustrated in FIG. 4B, an upper dielectric deck 426 including aplurality pairs of sacrificial layer 406 and dielectric layer 408 isformed above lower dielectric deck 404. Upper dielectric deck 426 can beformed by one or more thin film deposition processes including, but notlimited to, CVD, PVD, ALD, or any combination thereof. In someembodiments, an inter-deck dielectric layer 424, such as a layer ofsilicon nitride, is deposited on lower dielectric deck 404 prior to theformation of upper dielectric deck 426, such that upper dielectric deck426 is deposited on inter-deck dielectric layer 424. Similar to lowerdielectric deck 404, a plurality of polysilicon layers and a pluralityof silicon nitride layers can be alternatingly deposited above lowerdielectric deck 404 to form upper dielectric deck 426. A dielectricstack 428 including lower and upper dielectric decks 404 and 426 isthereby formed. As illustrated in FIG. 4B, an upper channel hole 430 isanother opening formed extending vertically through upper dielectricdeck 426 to expose channel plug 420 of lower channel structure 422.Upper channel hole 430 can be aligned with lower channel structure 422so as to expose at least part of channel plug 420. In some embodiments,fabrication processes for forming upper channel hole 430 include wetetching and/or dry etching, such as DRIE.

As illustrated in FIG. 4C, an inter-deck plug 431 can be formed aboveand in contact with channel plug 420 of lower channel structure 422. Insome embodiments, inter-deck plug 431 is formed by patterning inter-deckdielectric layer 424 and depositing semiconductor materials, such aspolysilicon, on channel plug 420 by one or more thin film depositionprocesses including, but not limited to, CVD, PVD, ALD, or anycombination thereof. As illustrated in FIG. 4C, a memory film 432(including a blocking layer, a storage layer, and a tunneling layer) anda semiconductor channel 434 are formed along the sidewall of upperchannel hole 430 (as shown in FIG. 4B) and above inter-deck plug 431. Insome embodiments, memory film 432 is first deposited along the sidewallof upper channel hole 430 and above inter-deck plug 431, andsemiconductor channel 434 is then deposited over memory film 432 usingone or more thin film deposition processes, such as ALD, CVD, PVD, anyother suitable processes, or any combination thereof. As illustrated inFIG. 4C, a capping layer 438, such as a silicon oxide layer, is formedin upper channel hole 430 to fully or partially fill the remaining spaceof upper channel hole 430 using one or more thin film depositionprocesses, such as CVD, PVD, ALD, electroplating, electroless plating,or any combination thereof. As illustrated in FIG. 4C, a channel plug436 is formed in the upper portion of upper channel hole 430 (shown inFIG. 4B) by depositing semiconductor materials, such as polysilicon,into a recess by one or more thin film deposition processes, such asCVD, PVD, ALD, electroplating, electroless plating, or any combinationthereof. An upper channel structure 440 is thereby formed through upperdielectric deck 426. A NAND memory string 442 including lower and upperchannel structures 422 and 440 is thereby formed through dielectricstack 428.

FIGS. 4A-4C illustrate an exemplary fabrication process for forming NANDmemory string 442 having a DCF structure. A different NAND memory stringhaving a SCF structure can be formed as shown in FIGS. 7A-7C. In someembodiments, to form the NAND memory string, a first dielectric deck isformed, a second dielectric deck is formed above the first dielectricdeck, and a single channel structure extending vertically through thefirst and second dielectric decks is formed.

Referring to FIG. 7A, a lower dielectric deck 704 including a pluralitypairs of a sacrificial layer 706 and a dielectric layer 708 is formedabove a silicon substrate 702. Lower dielectric deck 704 includesinterleaved sacrificial layers 706 and dielectric layers 708, accordingto some embodiments. In some embodiments, each dielectric layer 708includes a layer of silicon nitride, and each sacrificial layer 706includes a layer of polysilicon. That is, a plurality of polysiliconlayers and a plurality of silicon nitride layers can be alternatinglydeposited above silicon substrate 702 to form lower dielectric deck 704using one or more thin film deposition processes including, but notlimited to, CVD, PVD, ALD, or any combination thereof. Polysilicon andsilicon nitride are a pair of materials having high etching selectivity,for example, greater than 30, according to some embodiments. It isunderstood that other pairs of materials having high etching selectivitymay be used the materials of dielectric layers 708 and sacrificiallayers 706 in other embodiments. As illustrated in FIG. 7A, a lowerchannel hole 710 is an opening formed extending vertically through lowerdielectric deck 704. In some embodiments, fabrication processes forforming lower channel hole 710 include wet etching and/or dry etching,such as DRIE. The etching process through lower dielectric deck 704 maynot stop at the top surface of silicon substrate 702 and may continue toetch part of silicon substrate 702.

As illustrated in FIG. 7B, a semiconductor plug 712 can be formed byfilling the lower portion of lower channel hole 710 (as shown in FIG.7A) with single-crystal silicon epitaxially grown from silicon substrate702 in any suitable directions (e.g., from bottom surface and/or sidesurface) using VPE, LPE, MPE, or any combinations thereof. Asillustrated in FIG. 7B, a sacrificial layer 714 is deposited using oneor more thin film deposition processes, such as PVD, CVD, ALD,electroplating, electroless plating, or any combinations thereof, topartially or fully fill lower channel hole 710 (shown in FIG. 7A).Sacrificial layer 714 can include any suitable material that is to beremoved in a later process. To avoid removing sacrificial layer 706and/or dielectric layer 708 together with sacrificial layer 714,sacrificial layer 714 and sacrificial layer 706 and/or dielectric layer708 include different materials, according to some embodiments.

As illustrated in FIG. 7B, an upper dielectric deck 718 including aplurality pairs of sacrificial layer 706 and dielectric layer 708 isformed above lower upper dielectric deck 704. Upper dielectric deck 718can be formed by one or more thin film deposition processes including,but not limited to, CVD, PVD, ALD, or any combination thereof. In someembodiments, an inter-deck dielectric layer 716, such as a layer ofsilicon nitride, is deposited on lower dielectric deck 704 prior to theformation of upper dielectric deck 718, such that upper dielectric deck718 is deposited on inter-deck dielectric layer 716. Similar to lowerdielectric deck 704, a plurality of polysilicon layers and a pluralityof silicon nitride layers can be alternatingly deposited above lowerdielectric deck 704 to form upper dielectric deck 718. A dielectricstack 722 including lower and upper dielectric decks 704 and 718 isthereby formed. As illustrated in FIG. 7B, an upper channel hole 720 isanother opening formed extending vertically through upper dielectricdeck 718 to expose sacrificial layer 714. Upper channel hole 720 can bealigned with sacrificial layer 714 so as to expose at least part ofsacrificial layer 714. In some embodiments, fabrication processes forforming upper channel hole 720 include wet etching and/or dry etching,such as DRIE.

As illustrated in FIG. 7C, sacrificial layer 714 (shown in FIG. 7B) isremoved in lower dielectric deck 704 by wet etching and/or dry etching.After the removal of sacrificial layer 714, lower channel hole 710 (asshown in FIG. 7A) becomes open again and connected with upper channelhole 720. As illustrated in FIG. 7C, a memory film 724 (including ablocking layer, a storage layer, and a tunneling layer) and asemiconductor channel 726 are formed along the sidewall of lower andupper channel holes 710 and 720 and above semiconductor plug 712. Insome embodiments, memory film 724 is first deposited along the sidewallof lower and upper channel holes 710 and 720 and above semiconductorplug 712, and semiconductor channel 726 is then deposited over memoryfilm 724. The blocking layer, storage layer, and tunneling layer can besubsequently deposited in this order using one or more thin filmdeposition processes, such as ALD, CVD, PVD, any other suitableprocesses, or any combination thereof, to form memory film 724.Semiconductor channel 726 can then be formed by depositing polysiliconon the tunneling layer using one or more thin film deposition processes,such as ALD, CVD, PVD, any other suitable processes, or any combinationthereof. Semiconductor channel 726 can be in contact with semiconductorplug 712 using, for example, a SONO punch process. In some embodiments,semiconductor channel 726 is deposited in lower and upper channel holes710 and 720 without completely filling lower and upper channel holes 710and 720. As illustrated in FIG. 7C, a capping layer 730, such as asilicon oxide layer, is formed in lower and upper channel holes 710 and720 to fully or partially fill the remaining space of lower and upperchannel holes 710 and 720 using one or more thin film depositionprocesses, such as CVD, PVD, ALD, electroplating, electroless plating,or any combination thereof. As illustrated in FIG. 7C, a channel plug728 is formed in the upper portion of upper channel hole 720 (shown inFIG. 7B). Channel plug 728 can be formed by depositing semiconductormaterials, such as polysilicon, into a recess by one or more thin filmdeposition processes, such as CVD, PVD, ALD, electroplating, electrolessplating, or any combination thereof. A single channel structure 732 isthereby formed through lower and upper dielectric decks 704 and 718. ANAND memory string 734 including single channel structure 732 is therebyformed through dielectric stack 722.

Method 1000 proceeds to operation 1004, as illustrated in FIG. 10, inwhich a slit opening extending vertically through the interleavedsacrificial layers and dielectric layers of the dielectric stack isformed. As illustrated in FIG. 5A, a slit opening 502 is formed by wetetching and/or dry etching (e.g., DRIE) of sacrificial layers and 406dielectric layers 408 (e.g., polysilicon and silicon nitride) throughdielectric stack 428 (as shown in FIG. 4C).

Method 1000 proceeds to operation 1006, as illustrated in FIG. 10, inwhich a plurality of lateral recesses are formed by removing thesacrificial layers through the slit opening. In some embodiments, toform the plurality of lateral recesses, a wet etchant is applied throughthe slit opening. The wet etchant can include Tetramethylammoniumhydroxide (TMAH). In some embodiments, the polysilicon layers are etchedselective to the silicon nitride layers to form the plurality of lateralrecesses.

As illustrated in FIG. 5A, lateral recesses 504 are formed by removingsacrificial layers 406 through slit opening 502. In some embodiments,sacrificial layers 406 (as shown in FIG. 4C) are removed by applyingetching solutions through slit opening 502, such that sacrificial layers406 are removed, creating lateral recesses 504 interleaved betweendielectric layers 408. In some embodiments in which each sacrificiallayer 406 is a polysilicon layer and each dielectric layer 408 is asilicon nitride layer, the polysilicon layers are etched by wet etchant,such as TMAH, which etches polysilicon selective to silicon nitride toform lateral recesses 504. The selectivity between etching polysiliconand etching silicon nitride is higher than that between etching siliconnitride and silicon oxide and thus, can avoid the nonuniform dielectriclayer loss occurred to some known 3D memory devices. Due to high wetetch selectivity of silicon to silicon nitride, almost no siliconnitride dielectric layer loss occurs during the removal of polysiliconsacrificial layer removal, according to some embodiments.

Method 1000 proceeds to operation 1008, as illustrated in FIG. 10, inwhich a plurality of gate-to-gate dielectric layers are formed byoxidizing the dielectric layers through the slit opening and the lateralrecesses. In some embodiments, to form the plurality of gate-to-gatedielectric layers, oxygen diffusion concentration is controlled, suchthat each of the gate-to-gate dielectric layers consists of a siliconoxynitride layer. In some embodiments, to form the plurality ofgate-to-gate dielectric layers, oxygen diffusion concentration iscontrolled, such that each of the gate-to-gate dielectric layersincludes the silicon oxynitride layer and at least one silicon oxidelayer. Each of the gate-to-gate dielectric layers can include thesilicon oxynitride layer stacked between two silicon oxide layers. Insome embodiments, the silicon nitride layers are oxidized, such thateach of the gate-to-gate dielectric layers includes the siliconoxynitride layer and at least one silicon oxide layer. Each of thesilicon nitride layers becomes the silicon oxynitride layer, accordingto some embodiments. Each of the silicon nitride layers becomes thesilicon oxynitride layer and at least one silicon oxide layer, accordingto some embodiments. Each of the silicon nitride layers can become thesilicon oxynitride layer stacked between two silicon oxide layers.

As illustrated in FIG. 5B, a plurality of gate-to-gate dielectric layers506 interleaved between lateral recesses 504 are formed. Eachgate-to-gate dielectric layer 506 can include a silicon oxynitride layerformed by oxidizing dielectric layers 408 through slit opening 502 andlateral recesses 504. In some embodiments, the silicon nitride layersare oxidized, such that each of the silicon nitride layers becomes atleast a silicon oxynitride layer. The oxidizing process can be thermaloxidation and/or wet chemical oxidation. Either dry oxidation usingmolecular oxygen as the oxidant or wet oxidation using water vapor asthe oxidant can be used to form the silicon oxynitride layers ofgate-to-gate dielectric layers 506 at a temperature, for example, notgreater than about 850° C. In some embodiments, the thermal oxidation isperformed between about 500° C. and about 850° C., such as between 500°C. and 850° C. (e.g., 500° C., 550° C., 600° C., 650° C., 700° C., 750°C., 800° C., 850° C., any range bounded by the lower end by any of thesevalues, or in any range defined by any two of these values). In someembodiments, the thermal oxidation is performed at about 700° C., suchas 700° C. Slit opening 502 and lateral recesses 506 can providepassageway for transporting oxygen gas and/or water vapor to siliconnitride dielectric layers 408 (as shown in FIG. 5A). By controlling theoxygen diffusion concentration (e.g., oxygen concentration gradient)during the oxidization process, various types of silicon oxynitridelayers of gate-to-gate dielectric layers 506 can be formed from siliconnitride dielectric layers 408. In one example, each gate-to-gatedielectric layer 506 consists of a silicon oxynitride layer, i.e.,including only a single silicon oxynitride layer. In another example,each gate-to-gate dielectric layer 506 is a composite layer having asilicon oxynitride layer and at least one silicon oxide layer. Forexample, each gate-to-gate dielectric layer 506 may include a siliconoxynitride layer stacked between two silicon oxide layers. It isunderstood that silicon may be oxidized into silicon oxide by the sameoxidization process for forming gate-to-gate dielectric layers 506 or byanother oxidization process prior to the oxidization process for forminggate-to-gate dielectric layers 506. For example, the sidewall ofsemiconductor plug 412 and the bottom surface of slit opening 502 may beoxidized into silicon oxide.

Method 1000 proceeds to operation 1010, as illustrated in FIG. 10, inwhich a memory stack including a plurality of interleaved gateconductive layers and the gate-to-gate dielectric layers is formed bydepositing the gate conductive layers into the lateral recesses throughthe slit opening. In some embodiments, each of the gate conductivelayers includes a metal layer. A plurality of metal layers can bedeposited into the lateral recesses. In some embodiments, each of thegate conductive layers includes a doped polysilicon layer.

As illustrated in FIG. 5C, a plurality of gate conductive layers 508 aredeposited into lateral recesses 504 (as shown in FIG. 5B) through slitopening 502. In some embodiments, gate dielectric layers (not shown) aredeposited into lateral recesses 504 priori to gate conductive layers508, such that gate conductive layers 508 are deposited on the gatedielectric layers. Gate conductive layers 508 can be deposited using oneor more thin film deposition processes, such as ALD, CVD, PVD, any othersuitable processes, or any combination thereof. Gate conductive layers508 can include conductive materials. In some embodiments, each gateconductive layer 508 includes a metal layer including, not limited to,W, Co, Cu, Al, or any combination thereof. In some embodiments, eachgate conductive layer 508 includes a doped polysilicon layer. Thepolysilicon layer can be doped using ion implantation and/or thermaldiffusion to a desired doping concentration with any suitable dopant tobecome a conductive material that can be used as the material of gateconductive layers 508. A lower memory deck 510 including a plurality ofinterleaved gate conductive layers 508 and gate-to-gate dielectriclayers 506 is thereby formed, which replaces lower dielectric deck 404.An upper memory deck 512 including a plurality of interleaved gateconductive layers 508 and gate-to-gate dielectric layers 506 is therebyformed, which replaces upper dielectric deck 426. As a result, a memorystack 514 including lower and upper memory decks 510 and 512 is therebyformed, which replaces dielectric stack 428. NAND memory string 442(having a DCF structure) is thereby formed extending vertically throughmemory stack 514 including a plurality of interleaved gate conductivelayers 508 and gate-to-gate dielectric layers 506.

As illustrated in FIG. 5D, etch-back recesses 516 are formed in eachgate conductive layer 508 abutting the sidewall of slit opening 502.Etch-back recesses 516 can be etched-back using wet etching and/or dryetching processes through slit opening 502. A spacer 518 including oneor more dielectric layers, such as silicon oxide and silicon nitride, isdeposited into etch-back recesses 516 and along the sidewall of slitopening 502 using one or more thin film deposition processes, such asALD, CVD, PVD, any other suitable processes, or any combination thereof.In some embodiments, a conductor layer is then deposited over spacer 518to fill the remaining space of slit opening 502 to form a slit contact(not shown).

Similarly, NAND memory string 734 (having a SCF structure) can be formedextending vertically through a memory stack 814 including a plurality ofinterleaved gate conductive layers 808 and gate-to-gate dielectriclayers 806, as illustrated in FIGS. 8A-8D. As illustrated in FIG. 8A,lateral recesses 804 are formed by removing sacrificial layers 706through slit opening 802. In some embodiments, sacrificial layers 706(as shown in FIG. 7C) are removed by applying etching solutions throughslit opening 802, such that sacrificial layers 706 are removed, creatinglateral recesses 804 interleaved between dielectric layers 708. In someembodiments in which each sacrificial layer 706 is a polysilicon layerand each dielectric layer 708 is a silicon nitride layer, thepolysilicon layers are etched by wet etchant, such as TMAH, which etchespolysilicon selective to silicon nitride to form lateral recesses 804.

As illustrated in FIG. 8B, a plurality of gate-to-gate dielectric layers806 interleaved between lateral recesses 804 are formed. Eachgate-to-gate dielectric layer 806 can include a silicon oxynitride layerformed by oxidizing dielectric layers 708 (as shown in FIG. 7C) throughslit opening 802 and lateral recesses 804. In some embodiments, thesilicon nitride layers are oxidized, such that each of the siliconnitride layers becomes at least a silicon oxynitride layer. Theoxidizing process can be thermal oxidation and/or wet chemicaloxidation. Either dry oxidation using molecular oxygen as the oxidant orwet oxidation using water vapor as the oxidant can be used to form thesilicon oxynitride layers of gate-to-gate dielectric layers 806.

As illustrated in FIG. 8C, a plurality of gate conductive layers 808 aredeposited into lateral recesses 804 (as shown in FIG. 8B) through slitopening 802. In some embodiments, gate dielectric layers (not shown) aredeposited into lateral recesses 804 priori to gate conductive layers808, such that gate conductive layers 808 are deposited on the gatedielectric layers. Gate conductive layers 808 can be deposited using oneor more thin film deposition processes, such as ALD, CVD, PVD, any othersuitable processes, or any combination thereof. Each gate conductivelayer 808 can include a metal layer or a doped polysilicon layer. Alower memory deck 810 including a plurality of interleaved gateconductive layers 808 and gate-to-gate dielectric layers 806 is therebyformed, which replaces lower dielectric deck 704. An upper memory deck812 including a plurality of interleaved gate conductive layers 808 andgate-to-gate dielectric layers 806 is thereby formed, which replacesupper dielectric deck 718. As a result, a memory stack 814 includinglower and upper memory decks 810 and 812 is thereby formed, whichreplaces dielectric stack 722. NAND memory string 734 (having a SCFstructure) is thereby formed extending vertically through memory stack814 including a plurality of interleaved gate conductive layers 808 andgate-to-gate dielectric layers 806.

As illustrated in FIG. 8D, etch-back recesses 816 are formed in eachgate conductive layer 808 abutting the sidewall of slit opening 802.Etch-back recesses 816 can be etched-back using wet etching and/or dryetching processes through slit opening 802. A spacer 818 including oneor more dielectric layers, such as silicon oxide and silicon nitride, isdeposited into etch-back recesses 816 and along the sidewall of slitopening 802 using one or more thin film deposition processes, such asALD, CVD, PVD, any other suitable processes, or any combination thereof.In some embodiments, a conductor layer is then deposited over spacer 818to fill the remaining space of slit opening 802 to form a slit contact(not shown).

FIGS. 4A-4C illustrate an exemplary fabrication process for forming aNAND memory string, according to some embodiments of the presentdisclosure. FIGS. 6A and 6B illustrate an exemplary fabrication processfor forming a 3D memory device with a memory stack having siliconnitride gate-to-gate dielectric layers, according to some embodiments ofthe present disclosure. FIGS. 7A-7C illustrate an exemplary fabricationprocess for forming another NAND memory string, according to someembodiments of the present disclosure. FIGS. 9A and 9B illustrate anexemplary fabrication process for forming another 3D memory device witha memory stack having silicon nitride gate-to-gate dielectric layers,according to some embodiments of the present disclosure. FIG. 11illustrates a flowchart of an exemplary method 1100 for forming a 3Dmemory device with a memory stack having silicon nitride gate-to-gatedielectric layers, according to some embodiments of the presentdisclosure. Examples of the 3D memory device depicted in FIGS. 4A-4C,6A, 6B, 7A-7C, 9A, and 9B include 3D memory devices 300 and 301 depictedin FIGS. 3A and 3B. FIGS. 4A-4C, 6A, 6B, 7A-7C, 9A, 9B, and 11 will bedescribed together. It is understood that the operations shown in method1100 are not exhaustive and that other operations can be performed aswell before, after, or between any of the illustrated operations.Further, some of the operations may be performed simultaneously, or in adifferent order than shown in FIG. 11.

Referring to FIG. 11, method 1100 starts at operation 1102, in which amemory stack including a plurality of interleaved gate conductive layersand gate-to-gate dielectric layers is formed above a substrate. Each ofthe gate-to-gate dielectric layers includes a silicon nitride layer. Insome embodiments, each of the gate conductive layers includes a dopedpolysilicon layer. In some embodiments, each of the gate conductivelayers includes a metal layer. To form the memory stack, a first memorydeck is formed, and a second memory deck is formed above the firstmemory deck. In some embodiments, a plurality of doped polysiliconlayers and a plurality of silicon nitride layers are alternatinglydeposited above the substrate to form the memory stack.

Method 1100 proceeds to operation 1104, as illustrated in FIG. 11, inwhich a NAND memory string extending vertically through the interleavedgate conductive layers and gate-to-gate dielectric layers of the memorystack is formed. In some embodiments, to form the NAND memory string, afirst channel structure extending vertically through the first memorydeck is formed, an inter-deck plug is formed above and in contact withthe first channel structure, and a second channel structure extendingvertically through the second memory deck is formed above and in contactwith the inter-deck plug. In some embodiments, to form the NAND memorystring, a single channel structure extending vertically through thefirst and second memory decks is formed. In some embodiments, a channelstructure extending vertically through the doped polysilicon layers andsilicon nitride layers is formed. In some embodiments, to form thechannel structure, a channel hole extending vertically through the dopedpolysilicon layers and silicon nitride layers and into the substrate isetched, a semiconductor plug is epitaxially grown from the substrateonto a bottom surface of the channel hole, and a memory film and asemiconductor channel are subsequently deposited along a sidewall of thechannel hole and above the semiconductor plug.

As described above in detail with respect to FIGS. 4A-4C, NAND memorystring 442 (having a DCF structure) extending vertically throughinterleaved gate conductive layers 406 and gate-to-gate dielectriclayers 408 is formed. It is understood that although layers 406 and 408are described as sacrificial layers and dielectric layers above,respectively, with respect to FIG. 10, layers 406 and 408 may be used asgate conductive layers and gate-to-gate dielectric layers, respectively,as well with respect to FIG. 11. In some embodiments, each gateconductive layer 406 includes a metal layer. In some embodiments, eachgate conductive layer 406 includes a doped polysilicon layer. Eachgate-to-gate dielectric layer 408 can include a silicon nitride layer.The details of forming NAND memory string 442 extending verticallythrough memory stack 428 including interleaved gate conductive layers406 and gate-to-gate dielectric layers 408 are described above and thus,are not repeated. Different from the example described above withrespect to FIG. 10, an oxidization process may not be used in thisexample, such that each gate-to-gate dielectric layer 408 does notinclude a silicon oxide layer or a silicon oxynitride layer.

Similarly, as described above in detail with respect to FIGS. 7A-7C,NAND memory string 734 (having a SCF structure) extending verticallythrough interleaved gate conductive layers 706 and gate-to-gatedielectric layers 708 is formed. It is understood that although layers706 and 708 are described as sacrificial layers and dielectric layersabove, respectively, with respect to FIG. 10, layers 706 and 708 may beused as gate conductive layers and gate-to-gate dielectric layers,respectively, as well with respect to FIG. 11. In some embodiments, eachgate conductive layer 706 includes a metal layer. In some embodiments,each gate conductive layer 706 includes a doped polysilicon layer. Eachgate-to-gate dielectric layer 708 can include a silicon nitride layer.The details of forming NAND memory string 734 extending verticallythrough memory stack 722 including interleaved gate conductive layers706 and gate-to-gate dielectric layers 708 are described above and thus,are not repeated. Different from the example described above withrespect to FIG. 10, an oxidization process may not be used in thisexample, such that each gate-to-gate dielectric layer 708 does notinclude a silicon oxide layer or a silicon oxynitride layer.

Method 1100 proceeds to operation 1106, as illustrated in FIG. 11, inwhich a slit structure extending vertically through the interleaved gateconductive layers and gate-to-gate dielectric layers of the memory stackis formed. In some embodiments, to form the slit structure, a slitopening extending vertically through the interleaved gate conductivelayers and gate-to-gate dielectric layers of the memory stack is formed,an etch-back recess is formed in each of the gate conductive layersabutting a sidewall of the slit opening, and a spacer is formed in theetch-back recesses and along the sidewall of the slit opening.

As illustrated in FIG. 6A, a slit opening 602 is formed by wet etchingand/or dry etching (e.g., DRIE) of gate conductive layers 406 andgate-to-gate dielectric layers 408 (e.g., polysilicon layers and siliconnitride layers, respectively) through memory stack 428. As illustratedin FIG. 6B, etch-back recesses 604 are formed in each gate conductivelayer 406 abutting the sidewall of slit opening 602. Etch-back recesses604 can be etched-back using wet etching and/or dry etching processesthrough slit opening 602. A spacer 606 including one or more dielectriclayers, such as silicon oxide and silicon nitride, is deposited intoetch-back recesses 604 and along the sidewall of slit opening 602 usingone or more thin film deposition processes, such as ALD, CVD, PVD, anyother suitable processes, or any combination thereof. In someembodiments, a conductor layer is then deposited over spacer 606 to fillthe remaining space of slit opening 602 to form a slit contact (notshown).

Similarly, as illustrated in FIG. 9A, a slit opening 902 is formed bywet etching and/or dry etching (e.g., DRIE) of gate conductive layers706 and gate-to-gate dielectric layers 708 (e.g., polysilicon layers andsilicon nitride layers, respectively) through memory stack 722. Asillustrated in FIG. 9B, etch-back recesses 904 are formed in each gateconductive layer 706 abutting the sidewall of slit opening 902.Etch-back recesses 904 can be etched-back using wet etching and/or dryetching processes through slit opening 902. A spacer 906 including oneor more dielectric layers, such as silicon oxide and silicon nitride, isdeposited into etch-back recesses 904 and along the sidewall of slitopening 902 using one or more thin film deposition processes, such asALD, CVD, PVD, any other suitable processes, or any combination thereof.In some embodiments, a conductor layer is then deposited over spacer 906to fill the remaining space of slit opening 902 to form a slit contact(not shown).

According to one aspect of the present disclosure, a 3D memory deviceincludes a substrate, a memory stack, and a NAND memory string. Thememory stack includes a plurality of interleaved gate conductive layersand gate-to-gate dielectric layers above the substrate. Each of thegate-to-gate dielectric layers includes a silicon oxynitride layer. TheNAND memory string extends vertically through the interleaved gateconductive layers and gate-to-gate dielectric layers of the memorystack.

In some embodiments, each of the gate-to-gate dielectric layers consistsof a silicon oxynitride layer. In some embodiments, each of thegate-to-gate dielectric layers includes the silicon oxynitride layer andat least one silicon oxide layer. Each of gate-to-gate dielectric layerscan include the silicon oxynitride layer stacked between two siliconoxide layers.

In some embodiments, the memory stack includes a first memory deck abovethe substrate and a second memory deck above the first memory deck. theNAND memory string includes a first channel structure extendingvertically through the first memory deck, a second channel structureextending vertically through the second memory deck, and an inter-deckplug vertically between and in contact with the first channel structureand the second channel structure, respectively, according to someembodiments. In some embodiments, the NAND memory string includes asingle channel structure extending vertically through the first memorydeck and the second memory deck.

In some embodiments, each of the gate conductive layers includes a metallayer. In some embodiments, each of the gate conductive layers includesa doped polysilicon layer.

According to another aspect of the present disclosure, a method forforming a 3D memory device is disclosed. A NAND memory string extendingvertically through a dielectric stack including a plurality ofinterleaved sacrificial layers and dielectric layers above a substrateis formed. A slit opening extending vertically through the interleavedsacrificial layers and dielectric layers of the dielectric stack isformed. A plurality of lateral recesses is formed by removing thesacrificial layers through the slit opening. A plurality of gate-to-gatedielectric layers are formed by oxidizing the dielectric layers throughthe slit opening and the lateral recesses. A memory stack including aplurality of interleaved gate conductive layers and the gate-to-gatedielectric layers by depositing the gate conductive layers into thelateral recesses through the slit opening.

In some embodiments, each of the sacrificial layers includes apolysilicon layer, and each of the dielectric layers includes a siliconnitride layer.

In some embodiments, to form the plurality of gate-to-gate dielectriclayers, oxygen diffusion concentration is controlled, such that each ofthe gate-to-gate dielectric layers consists of a silicon oxynitridelayer. In some embodiments to form the plurality of gate-to-gatedielectric layers, oxygen diffusion concentration is controlled, suchthat each of the gate-to-gate dielectric layers includes the siliconoxynitride layer and at least one silicon oxide layer. Each of thegate-to-gate dielectric layers can include the silicon oxynitride layerstacked between two silicon oxide layers.

In some embodiments, to form the plurality of lateral recesses, a wetetchant is applied through the slit opening. The wet etchant can includeTMAH.

In some embodiments, each of the gate conductive layers includes a metallayer. In some embodiments, each of the gate conductive layers includesa doped polysilicon layer.

In some embodiments, to form the NAND memory string, a first dielectricdeck is formed; a first channel structure extending vertically throughthe first dielectric deck is formed; an inter-deck plug is formed aboveand in contact with the first channel structure; a second dielectricdeck is formed above the first dielectric deck; and a second channelstructure extending vertically through the second dielectric deck isformed above and in contact with the inter-deck plug.

In some embodiments, to form the NAND memory string, a first dielectricdeck is formed; a second dielectric deck is formed above the firstdielectric deck; and a single channel structure extending verticallythrough the first and second dielectric decks is formed.

According to still another aspect of the present disclosure, a methodfor forming a 3D memory device is disclosed. A plurality of polysiliconlayers and a plurality of silicon nitride layers are alternatinglydeposited above a substrate. A channel structure extending verticallythrough the polysilicon layers and silicon nitride layers is formed. Thepolysilicon layers are etched selective to the silicon nitride layers toform a plurality of lateral recesses. The silicon nitride layers areoxidized, such that each of the silicon nitride layers becomes at leasta silicon oxynitride layer. A plurality of metal layers are depositedinto the lateral recesses.

In some embodiments, each of the silicon nitride layers becomes thesilicon oxynitride layer. In some embodiments, each of the siliconnitride layers becomes the silicon oxynitride layer and at least onesilicon oxide layer. In some embodiments, each of the silicon nitridelayers becomes the silicon oxynitride layer stacked between two siliconoxide layers.

The foregoing description of the specific embodiments will so reveal thegeneral nature of the present disclosure that others can, by applyingknowledge within the skill of the art, readily modify and/or adapt forvarious applications such specific embodiments, without undueexperimentation, without departing from the general concept of thepresent disclosure. Therefore, such adaptations and modifications areintended to be within the meaning and range of equivalents of thedisclosed embodiments, based on the teaching and guidance presentedherein. It is to be understood that the phraseology or terminologyherein is for the purpose of description and not of limitation, suchthat the terminology or phraseology of the present specification is tobe interpreted by the skilled artisan in light of the teachings andguidance.

Embodiments of the present disclosure have been described above with theaid of functional building blocks illustrating the implementation ofspecified functions and relationships thereof. The boundaries of thesefunctional building blocks have been arbitrarily defined herein for theconvenience of the description. Alternate boundaries can be defined solong as the specified functions and relationships thereof areappropriately performed.

The Summary and Abstract sections may set forth one or more but not allexemplary embodiments of the present disclosure as contemplated by theinventor(s), and thus, are not intended to limit the present disclosureand the appended claims in any way.

The breadth and scope of the present disclosure should not be limited byany of the above-described exemplary embodiments, but should be definedonly in accordance with the following claims and their equivalents.

What is claimed is:
 1. A three-dimensional (3D) memory device,comprising: a substrate; a memory stack comprising a first memory deckabove the substrate, a second memory deck above the first memory deck,and an inter-deck dielectric layer right above the first memory deck andright below the second memory deck, each of the first memory deck andthe second memory deck comprising a plurality of interleaved gateconductive layers and gate-to-gate dielectric layers above thesubstrate, wherein the inter-deck dielectric layer is in direct contactwith and between the first memory deck and the second memory deck,wherein the inter-deck dielectric layer is a single layer including afirst silicon oxynitride layer and an inter-deck plug extending into theinter-deck dielectric layer between the first memory deck and the secondmemory deck and surrounded and electrically isolated by siliconoxynitride in the inter-deck dielectric layer, and each of thegate-to-gate dielectric layers comprises a second silicon oxynitridelayer stacked between two silicon oxide layers, wherein one of the twosilicon oxide layers is in direct contact with one of the gateconductive layers and the second silicon oxynitride layer, and anotherone of the two silicon oxide layers is in direct contact with anotherone of the gate conductive layers and the second silicon oxynitridelayer; and a NAND memory string extending vertically through theplurality of interleaved gate conductive layers and gate-to-gatedielectric layers of the memory stack, the NAND memory string comprisinga first channel structure extending vertically through the first memorydeck and a second channel structure extending vertically through thesecond memory deck, wherein each of the first channel structure and thesecond channel structure further comprises a first channel plug and asecond channel plug in an upper portion of the first channel structureand the second channel structure respectively, and the inter-deck plugis vertically between and in direct contact with a lower portion of thesecond channel structure and the first channel plug of the first channelstructure.
 2. The 3D memory device of claim 1, wherein each of the gateconductive layers comprises a metal layer.
 3. The 3D memory device ofclaim 1, wherein each of the gate conductive layers comprises a dopedpolysilicon layer.
 4. The 3D memory device of claim 1, wherein the oneand the other one of the gate conductive layers are adjacent to agate-to-gate dielectric layer of the plurality of gate-to-gatedielectric layers.
 5. The 3D memory device of claim 1, wherein each ofthe gate-to-gate dielectric layers consists of the second siliconoxynitride layer and the two silicon oxide layers.
 6. Athree-dimensional (3D) memory device, comprising: a substrate; a memorystack comprising a first memory deck above the substrate, a secondmemory deck above the first memory deck, and an inter-deck dielectriclayer right above the first memory deck and right below the secondmemory deck, each of the first memory deck and the second memory deckcomprising a plurality of interleaved gate conductive layers andgate-to-gate dielectric layers above the substrate, wherein theinter-deck dielectric layer is in direct contact with and between thefirst memory deck and the second memory deck, wherein the inter-deckdielectric layer is a single layer including a first silicon oxynitridelayer and an inter-deck plug extending into the inter-deck dielectriclayer between the first memory deck and the second memory deck andsurrounded and electrically isolated by silicon oxynitride in theinter-deck dielectric layer, and each of the gate-to-gate dielectriclayers consists of a second silicon oxynitride layer stacked between twosilicon oxide layers; and a NAND memory string extending verticallythrough the plurality of interleaved gate conductive layers andgate-to-gate dielectric layers of the memory stack, the NAND memorystring comprising a first channel structure extending vertically throughthe first memory deck and a second channel structure extendingvertically through the second memory deck, wherein each of the firstchannel structure and the second channel structure further comprises afirst channel plug and a second channel plug in an upper portion of thefirst channel structure and the second channel structure respectively,and the inter-deck plug is vertically between and in direct contact witha lower portion of the second channel structure and the first channelplug of the first channel structure.
 7. The 3D memory device of claim 6,wherein the two silicon oxide layers are each in direct contact with thesecond silicon oxynitride layer.
 8. The 3D memory device of claim 7,wherein the two silicon oxide layers are each in direct contact with twoadjacent gate conductive layers.
 9. The 3D memory device of claim 6,wherein each of the gate conductive layers comprises a metal layer. 10.The 3D memory device of claim 6, wherein each of the gate conductivelayers comprises a doped polysilicon layer.
 11. A three-dimensional (3D)memory device, comprising: a substrate; a memory stack comprising afirst memory deck above the substrate, a second memory deck above thefirst memory deck, and an inter-deck dielectric layer right above thefirst memory deck and right below the second memory deck, each of thefirst memory deck and the second memory deck comprising a plurality ofinterleaved gate conductive layers and gate-to-gate dielectric layersabove the substrate, wherein the inter-deck dielectric layer is indirect contact with and between the first memory deck and the secondmemory deck, wherein the inter-deck dielectric layer is a single layerincluding a first silicon oxynitride layer and an inter-deck plugextending into the inter-deck dielectric layer between the first memorydeck and the second memory deck and surrounded and electrically isolatedby silicon oxynitride in the inter-deck dielectric layer, and each ofthe gate-to-gate dielectric layers consists of a second siliconoxynitride layer and at least one silicon oxide layer, wherein the atleast one silicon oxide layer is in direct contact with the secondsilicon oxynitride layer and at least one of the gate conductive layers;and a NAND memory string extending vertically through the plurality ofinterleaved gate conductive layers and gate-to-gate dielectric layers ofthe memory stack, the NAND memory string comprising a first channelstructure extending vertically through the first memory deck and asecond channel structure extending vertically through the second memorydeck, wherein each of the first channel structure and the second channelstructure further comprises a first channel plug and a second channelplug in an upper portion of the first channel structure and the secondchannel structure respectively, and the inter-deck plug is verticallybetween and in direct contact with a lower portion of the second channelstructure and the first channel plug of the first channel structure. 12.The 3D memory device of claim 11, wherein each of the gate conductivelayers comprises a metal layer.
 13. The 3D memory device of claim 11,wherein each of the gate conductive layers comprises a doped polysiliconlayer.
 14. The 3D memory device of claim 1, wherein the inter-deck plugcomprises silicon.
 15. The 3D memory device of claim 1, wherein thefirst channel plug comprises an opening filled with Ti/TiN or Ta/TaN asan adhesive layer and tungsten as a conductor.
 16. The 3D memory deviceof claim 1, wherein the first channel structure further comprises asemiconductor plug in a lower portion of the first channel structure.17. The 3D memory device of claim 16 wherein the semiconductor plugcomprises single-crystal silicon.